Packaging structure of TOF distance measuring sensor
The utility model relates to the optical sensor field, and discloses a TOF distance measuring sensor packaging structure comprising a substrate, a distance measuring chip, a luminescent device, a first optical detector, a second optical detector, a housing, a light barrier, a first light transmissio...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the optical sensor field, and discloses a TOF distance measuring sensor packaging structure comprising a substrate, a distance measuring chip, a luminescent device, a first optical detector, a second optical detector, a housing, a light barrier, a first light transmission window, a second light transmission window, and a narrow band filter, thus obtaining the TOF distance measuring sensor packaging structure with small size and high performance; the first light detector, the light-emitting device and the second light detector are packaged in different cavities by arranging the light barrier and the shading glue, so that crosstalk of light signals is avoided, and the measurement precision is improved.
本实用新型涉及光学传感器领域,公开了一种TOF测距传感器的封装结构,包括:基底、测距芯片、发光器件、第一光探测器、第二光探测器、外壳、挡光板、第一透光窗口、第二透光窗口和窄带滤光片,得到小尺寸、高性能的TOF测距传感器封装结构,通过设置挡光板和遮光胶将第一光探测器、发光器件和第二光探测器封装至不同腔体中,避免光信号的串扰,提高测量精度。 |
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