Contact heat dissipation module of case

The utility model relates to the technical field of case heat dissipation, and discloses a case contact heat dissipation module which comprises a mounting plate, a mounting opening is formed in the surface of the mounting plate, a heat conduction mounting block is fixedly mounted in the correspondin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHI XIAOGUI, ZHANG SIDAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model relates to the technical field of case heat dissipation, and discloses a case contact heat dissipation module which comprises a mounting plate, a mounting opening is formed in the surface of the mounting plate, a heat conduction mounting block is fixedly mounted in the corresponding mounting opening, and a case body is fixedly clamped to the upper side of the heat conduction mounting block; a heat dissipation substrate is fixedly arranged on the lower side of the inner wall of the case body, a plurality of heat dissipation fins are uniformly and fixedly connected to the lower side of the heat dissipation substrate, the lower ends of the plurality of heat dissipation fins penetrate through the lower end of the case body, and a plurality of insertion grooves matched with the heat dissipation fins in an insertion manner are uniformly formed in the upper side of a heat conduction mounting block. And the inner side of the heat conduction mounting block is provided with a snakelike cooling channel