Heat dissipation structure of notebook computer

The heat dissipation structure comprises a shell, an installation opening is formed in the outer wall of the bottom of the shell, a bottom plate is connected to the inner wall of the installation opening in a clamped mode, partition plates are fixedly connected to the inner walls of the two sides of...

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1. Verfasser: PENG JINLING
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The heat dissipation structure comprises a shell, an installation opening is formed in the outer wall of the bottom of the shell, a bottom plate is connected to the inner wall of the installation opening in a clamped mode, partition plates are fixedly connected to the inner walls of the two sides of the shell, a heat dissipation mechanism is fixedly connected to the outer walls of the tops of the partition plates, and the heat dissipation mechanism comprises a copper box; the outer walls of the two sides of the copper box are fixedly connected with heat conduction plates, rectangular openings distributed at equal intervals are formed in the outer walls of the two heat conduction plates, an air outlet is formed in the outer wall of one side of the shell, and one end of the copper box is connected to the inner wall of the air outlet. The relatively independent heat dissipation copper box is arranged in the notebook computer shell, heat in the notebook computer is transferred to the copper box through contact of