Semiconductor wafer surface treatment device

The utility model belongs to the technical field of wafers, and particularly relates to a semiconductor wafer surface treatment device which comprises a support and a semiconductor wafer, and further comprises a clamping assembly used for clamping and fixing the semiconductor wafer and installed on the support, a polishing mechanism used for polishing the upper surface and the lower surface of the semiconductor wafer at the same time, and a polishing mechanism used for polishing the upper surface and the lower surface of the semiconductor wafer at the same time. The polishing mechanism is installed on the support, the support comprises a bottom plate and side plates, the side plates and a top plate are fixedly installed at the two ends of the top of the bottom plate, and the side plates are fixedly installed at the two ends of the bottom of the top plate. And the upper surface and the lower surface of the semiconductor wafer are polished at the same time through the polishing mechanism, the problem that an ex