Vacuum adsorption chuck
The utility model relates to the technical field of silicon wafer processing, in particular to a vacuum adsorption chuck. The vacuum adsorption chuck comprises a positioning disc, a connecting rod, a protection assembly and a connecting assembly. Wherein the positioning disc is provided with a first...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model relates to the technical field of silicon wafer processing, in particular to a vacuum adsorption chuck. The vacuum adsorption chuck comprises a positioning disc, a connecting rod, a protection assembly and a connecting assembly. Wherein the positioning disc is provided with a first connecting surface, a plurality of air inlet holes are formed in the first connecting surface, one end of the connecting rod is provided with a second connecting surface, the second connecting surface corresponds to the first connecting surface, a plurality of air outlet holes are further formed in the second connecting surface, and the air outlet holes and the air inlet holes are formed in a one-to-one correspondence mode. The protection assembly and the connecting assembly are both arranged between the first connecting surface and the second connecting surface, the protection assembly is used for communicating the multiple air inlet holes with the multiple air outlet holes, and the connecting assembly is arrange |
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