Ceramic circuit board with metalized through holes
The utility model discloses a ceramic circuit board with metalized through holes, which comprises a ceramic board main body, L-shaped boards are arranged at the left end and the right end of the ceramic board main body, two groups of heat dissipation holes are arranged in the middle of the upper end...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a ceramic circuit board with metalized through holes, which comprises a ceramic board main body, L-shaped boards are arranged at the left end and the right end of the ceramic board main body, two groups of heat dissipation holes are arranged in the middle of the upper end of the ceramic board main body, heat dissipation columns are arranged in the heat dissipation holes, two groups of via holes are arranged at the rear part of the upper end of the ceramic board main body, and the two groups of via holes are communicated with the L-shaped boards. The upper end of the ceramic plate body is provided with a protective layer, the upper end of the L-shaped plate on the left side is provided with a dust collection part, the dust collection part extends to the lower end of the ceramic plate body, and a support is arranged between the two L-shaped plates. According to the ceramic circuit board with the metalized through holes, dust in the via holes and the heat dissipation holes can be proc |
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