Multilayer HDI circuit board with interconnected inner layers
The utility model discloses a multilayer HDI circuit board with interconnected inner layers, which comprises vertical plates, the number of the vertical plates is two, the vertical plates are distributed left and right, transverse plates are installed at the ends, away from each other, of the two ve...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HUANG CHUNQIN LI WEIWEI |
| description | The utility model discloses a multilayer HDI circuit board with interconnected inner layers, which comprises vertical plates, the number of the vertical plates is two, the vertical plates are distributed left and right, transverse plates are installed at the ends, away from each other, of the two vertical plates, rectangular grooves are formed in the ends, close to each other, of the two vertical plates, a fixing part is arranged at the upper ends of the two vertical plates together, and the fixing part is connected with the transverse plates. The fixing part extends into the two vertical plates, an HDI circuit board body is jointly installed in the two rectangular grooves, and a protective layer is arranged at the upper end of the HDI circuit board body. According to the multilayer HDI circuit board with the interconnected inner layers, the HDI circuit board main body can be quickly disassembled through the arrangement of the fixing part, tools are not needed, the working efficiency is improved, the surface |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218998394UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218998394UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218998394UU3</originalsourceid><addsrcrecordid>eNrjZLD1Lc0pycxJrEwtUvBw8VRIzixKLs0sUUjKTyxKUSjPLMlQyMwrSS1Kzs_LS00uSU0BcvOAasE6inkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbyzn5GhhaWlhbGlSWioMVGKAIj3MTc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Multilayer HDI circuit board with interconnected inner layers</title><source>esp@cenet</source><creator>HUANG CHUNQIN ; LI WEIWEI</creator><creatorcontrib>HUANG CHUNQIN ; LI WEIWEI</creatorcontrib><description>The utility model discloses a multilayer HDI circuit board with interconnected inner layers, which comprises vertical plates, the number of the vertical plates is two, the vertical plates are distributed left and right, transverse plates are installed at the ends, away from each other, of the two vertical plates, rectangular grooves are formed in the ends, close to each other, of the two vertical plates, a fixing part is arranged at the upper ends of the two vertical plates together, and the fixing part is connected with the transverse plates. The fixing part extends into the two vertical plates, an HDI circuit board body is jointly installed in the two rectangular grooves, and a protective layer is arranged at the upper end of the HDI circuit board body. According to the multilayer HDI circuit board with the interconnected inner layers, the HDI circuit board main body can be quickly disassembled through the arrangement of the fixing part, tools are not needed, the working efficiency is improved, the surface</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; NATURALLY-OCCURRING ELECTRICITY ; PRINTED CIRCUITS ; STATIC ELECTRICITY</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230509&DB=EPODOC&CC=CN&NR=218998394U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230509&DB=EPODOC&CC=CN&NR=218998394U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG CHUNQIN</creatorcontrib><creatorcontrib>LI WEIWEI</creatorcontrib><title>Multilayer HDI circuit board with interconnected inner layers</title><description>The utility model discloses a multilayer HDI circuit board with interconnected inner layers, which comprises vertical plates, the number of the vertical plates is two, the vertical plates are distributed left and right, transverse plates are installed at the ends, away from each other, of the two vertical plates, rectangular grooves are formed in the ends, close to each other, of the two vertical plates, a fixing part is arranged at the upper ends of the two vertical plates together, and the fixing part is connected with the transverse plates. The fixing part extends into the two vertical plates, an HDI circuit board body is jointly installed in the two rectangular grooves, and a protective layer is arranged at the upper end of the HDI circuit board body. According to the multilayer HDI circuit board with the interconnected inner layers, the HDI circuit board main body can be quickly disassembled through the arrangement of the fixing part, tools are not needed, the working efficiency is improved, the surface</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>NATURALLY-OCCURRING ELECTRICITY</subject><subject>PRINTED CIRCUITS</subject><subject>STATIC ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD1Lc0pycxJrEwtUvBw8VRIzixKLs0sUUjKTyxKUSjPLMlQyMwrSS1Kzs_LS00uSU0BcvOAasE6inkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbyzn5GhhaWlhbGlSWioMVGKAIj3MTc</recordid><startdate>20230509</startdate><enddate>20230509</enddate><creator>HUANG CHUNQIN</creator><creator>LI WEIWEI</creator><scope>EVB</scope></search><sort><creationdate>20230509</creationdate><title>Multilayer HDI circuit board with interconnected inner layers</title><author>HUANG CHUNQIN ; LI WEIWEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218998394UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>NATURALLY-OCCURRING ELECTRICITY</topic><topic>PRINTED CIRCUITS</topic><topic>STATIC ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG CHUNQIN</creatorcontrib><creatorcontrib>LI WEIWEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG CHUNQIN</au><au>LI WEIWEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Multilayer HDI circuit board with interconnected inner layers</title><date>2023-05-09</date><risdate>2023</risdate><abstract>The utility model discloses a multilayer HDI circuit board with interconnected inner layers, which comprises vertical plates, the number of the vertical plates is two, the vertical plates are distributed left and right, transverse plates are installed at the ends, away from each other, of the two vertical plates, rectangular grooves are formed in the ends, close to each other, of the two vertical plates, a fixing part is arranged at the upper ends of the two vertical plates together, and the fixing part is connected with the transverse plates. The fixing part extends into the two vertical plates, an HDI circuit board body is jointly installed in the two rectangular grooves, and a protective layer is arranged at the upper end of the HDI circuit board body. According to the multilayer HDI circuit board with the interconnected inner layers, the HDI circuit board main body can be quickly disassembled through the arrangement of the fixing part, tools are not needed, the working efficiency is improved, the surface</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN218998394UU |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NATURALLY-OCCURRING ELECTRICITY PRINTED CIRCUITS STATIC ELECTRICITY |
| title | Multilayer HDI circuit board with interconnected inner layers |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T05%3A12%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HUANG%20CHUNQIN&rft.date=2023-05-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN218998394UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |