Multilayer HDI circuit board with interconnected inner layers
The utility model discloses a multilayer HDI circuit board with interconnected inner layers, which comprises vertical plates, the number of the vertical plates is two, the vertical plates are distributed left and right, transverse plates are installed at the ends, away from each other, of the two ve...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a multilayer HDI circuit board with interconnected inner layers, which comprises vertical plates, the number of the vertical plates is two, the vertical plates are distributed left and right, transverse plates are installed at the ends, away from each other, of the two vertical plates, rectangular grooves are formed in the ends, close to each other, of the two vertical plates, a fixing part is arranged at the upper ends of the two vertical plates together, and the fixing part is connected with the transverse plates. The fixing part extends into the two vertical plates, an HDI circuit board body is jointly installed in the two rectangular grooves, and a protective layer is arranged at the upper end of the HDI circuit board body. According to the multilayer HDI circuit board with the interconnected inner layers, the HDI circuit board main body can be quickly disassembled through the arrangement of the fixing part, tools are not needed, the working efficiency is improved, the surface |
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