Burn-in board for TO packaging device reliability test
The utility model discloses a burn-in board used for a TO packaging device reliability test. The burn-in board comprises a circuit board, a lifting platform, a connecting assembly and an adjusting assembly. The upper surface of the circuit board is provided with a plurality of grooves used for placi...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model discloses a burn-in board used for a TO packaging device reliability test. The burn-in board comprises a circuit board, a lifting platform, a connecting assembly and an adjusting assembly. The upper surface of the circuit board is provided with a plurality of grooves used for placing devices to be tested, and the periphery of each groove is provided with a metal sheet used for being connected with pins of the devices to be tested. A plurality of pressure heads in one-to-one correspondence with the grooves are arranged on the lower surface of the lifting table; the lifting platform is arranged above the circuit board through the connecting assembly, and the adjusting assembly is used for adjusting the height of the lifting platform so that the pressing head can abut against or leave the to-be-tested device in the groove. According to the utility model, the step of frequent plugging is avoided, on one hand, the reliability test requirement is met, and the risk of scratch of device pins can be |
---|