Pressing and covering testing mechanism for self-strength of storage chip
The utility model relates to the technical field of chip adhesive force testing, in particular to a pressing and covering testing mechanism for the self-strength of a storage chip, which comprises a base, a rotating seat arranged at the top of the base, a supporting column arranged in the rotating s...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model relates to the technical field of chip adhesive force testing, in particular to a pressing and covering testing mechanism for the self-strength of a storage chip, which comprises a base, a rotating seat arranged at the top of the base, a supporting column arranged in the rotating seat, a display screen arranged at the other end of the supporting column, and an electron microscope arranged below the display screen, an installation clamp is arranged below the electron microscope, a buffer base plate is installed in the installation clamp, an installation groove is formed in the upper portion of the buffer base plate, and a positioning hole is formed in the top of the installation groove. According to the utility model, a chip to be tested is placed inside the installation clamp, and then the positioning columns are inserted into the positioning holes, so that the cover plate can be installed inside the installation groove, and the deformation condition of the tested chip can be seen on the dis |
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