Forced cooling device and vacuum reflow soldering furnace

The utility model relates to the technical field of forced cooling, in particular to a forced cooling device and a vacuum reflow soldering furnace. The forced cooling device is characterized in that an air outlet channel is formed in an inner shell, and an air inducing mechanism is arranged between...

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Bibliographische Detailangaben
Hauptverfasser:	XU ZEHUA, XUE JIANGUANG, KANG CHANG-DONG, YANG YEYU, DU MIN, CHEN YUANMING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The utility model relates to the technical field of forced cooling, in particular to a forced cooling device and a vacuum reflow soldering furnace. The forced cooling device is characterized in that an air outlet channel is formed in an inner shell, and an air inducing mechanism is arranged between an air inlet channel and the air outlet channel; an inner pressurizing plate is fixed in the air outlet duct; the inner pressurizing plate divides the air outlet duct into a first high-pressure area and a second high-pressure area; and a refrigerating coil is fixed in the air outlet duct. The vacuum reflow soldering furnace comprises a forced cooling device, the forced cooling device is arranged in the cooling area and used for convection forced cooling. The vacuum reflow soldering furnace comprises a forced cooling device, the forced cooling device is connected with the water cooling mechanism and/or the air cooling mechanism. The forced cooling device is high in heat exchange efficiency and high in jig cooling ra