Wafer cooling device
The utility model provides a device for wafer cooling, and relates to the technical field of cooling devices, the device comprises an upper cooling disc and a semiconductor chilling plate control system, the bottom end of the upper cooling disc is provided with a lower cooling disc, the top end of t...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SHI ZHIHE |
| description | The utility model provides a device for wafer cooling, and relates to the technical field of cooling devices, the device comprises an upper cooling disc and a semiconductor chilling plate control system, the bottom end of the upper cooling disc is provided with a lower cooling disc, the top end of the lower cooling disc is provided with a U-shaped clamping groove, a semiconductor chilling plate A is installed in the U-shaped clamping groove, and the semiconductor chilling plate A is connected with the semiconductor chilling plate control system. A water pipe pressing plate is fixedly installed at the bottom end of the lower cooling disc, a device supporting column is arranged at the bottom end of the water pipe pressing plate, a cooling water pipe is fixedly installed on the side face of the lower cooling disc, a temperature control switch is installed at the bottom end of the lower cooling disc, and a PT temperature measuring probe is installed at the bottom end of the lower cooling disc. According to the wa |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218939608UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218939608UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218939608UU3</originalsourceid><addsrcrecordid>eNrjZBAJT0xLLVJIzs_PycxLV0hJLctMTuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaGFpbGlmYGFqGhxkQpAgCCoyF7</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer cooling device</title><source>esp@cenet</source><creator>SHI ZHIHE</creator><creatorcontrib>SHI ZHIHE</creatorcontrib><description>The utility model provides a device for wafer cooling, and relates to the technical field of cooling devices, the device comprises an upper cooling disc and a semiconductor chilling plate control system, the bottom end of the upper cooling disc is provided with a lower cooling disc, the top end of the lower cooling disc is provided with a U-shaped clamping groove, a semiconductor chilling plate A is installed in the U-shaped clamping groove, and the semiconductor chilling plate A is connected with the semiconductor chilling plate control system. A water pipe pressing plate is fixedly installed at the bottom end of the lower cooling disc, a device supporting column is arranged at the bottom end of the water pipe pressing plate, a cooling water pipe is fixedly installed on the side face of the lower cooling disc, a temperature control switch is installed at the bottom end of the lower cooling disc, and a PT temperature measuring probe is installed at the bottom end of the lower cooling disc. According to the wa</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; COLD ROOMS ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT PUMP SYSTEMS ; HEATING ; ICE-BOXES ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; REFRIGERATION MACHINES, PLANTS OR SYSTEMS ; REFRIGERATION OR COOLING ; REFRIGERATORS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230428&DB=EPODOC&CC=CN&NR=218939608U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230428&DB=EPODOC&CC=CN&NR=218939608U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHI ZHIHE</creatorcontrib><title>Wafer cooling device</title><description>The utility model provides a device for wafer cooling, and relates to the technical field of cooling devices, the device comprises an upper cooling disc and a semiconductor chilling plate control system, the bottom end of the upper cooling disc is provided with a lower cooling disc, the top end of the lower cooling disc is provided with a U-shaped clamping groove, a semiconductor chilling plate A is installed in the U-shaped clamping groove, and the semiconductor chilling plate A is connected with the semiconductor chilling plate control system. A water pipe pressing plate is fixedly installed at the bottom end of the lower cooling disc, a device supporting column is arranged at the bottom end of the water pipe pressing plate, a cooling water pipe is fixedly installed on the side face of the lower cooling disc, a temperature control switch is installed at the bottom end of the lower cooling disc, and a PT temperature measuring probe is installed at the bottom end of the lower cooling disc. According to the wa</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>COLD ROOMS</subject><subject>COMBINED HEATING AND REFRIGERATION SYSTEMS</subject><subject>COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT PUMP SYSTEMS</subject><subject>HEATING</subject><subject>ICE-BOXES</subject><subject>LIGHTING</subject><subject>LIQUEFACTION SOLIDIFICATION OF GASES</subject><subject>MANUFACTURE OR STORAGE OF ICE</subject><subject>MECHANICAL ENGINEERING</subject><subject>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</subject><subject>REFRIGERATION OR COOLING</subject><subject>REFRIGERATORS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJT0xLLVJIzs_PycxLV0hJLctMTuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaGFpbGlmYGFqGhxkQpAgCCoyF7</recordid><startdate>20230428</startdate><enddate>20230428</enddate><creator>SHI ZHIHE</creator><scope>EVB</scope></search><sort><creationdate>20230428</creationdate><title>Wafer cooling device</title><author>SHI ZHIHE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218939608UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>COLD ROOMS</topic><topic>COMBINED HEATING AND REFRIGERATION SYSTEMS</topic><topic>COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT PUMP SYSTEMS</topic><topic>HEATING</topic><topic>ICE-BOXES</topic><topic>LIGHTING</topic><topic>LIQUEFACTION SOLIDIFICATION OF GASES</topic><topic>MANUFACTURE OR STORAGE OF ICE</topic><topic>MECHANICAL ENGINEERING</topic><topic>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</topic><topic>REFRIGERATION OR COOLING</topic><topic>REFRIGERATORS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHI ZHIHE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHI ZHIHE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer cooling device</title><date>2023-04-28</date><risdate>2023</risdate><abstract>The utility model provides a device for wafer cooling, and relates to the technical field of cooling devices, the device comprises an upper cooling disc and a semiconductor chilling plate control system, the bottom end of the upper cooling disc is provided with a lower cooling disc, the top end of the lower cooling disc is provided with a U-shaped clamping groove, a semiconductor chilling plate A is installed in the U-shaped clamping groove, and the semiconductor chilling plate A is connected with the semiconductor chilling plate control system. A water pipe pressing plate is fixedly installed at the bottom end of the lower cooling disc, a device supporting column is arranged at the bottom end of the water pipe pressing plate, a cooling water pipe is fixedly installed on the side face of the lower cooling disc, a temperature control switch is installed at the bottom end of the lower cooling disc, and a PT temperature measuring probe is installed at the bottom end of the lower cooling disc. According to the wa</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN218939608UU |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS BLASTING COLD ROOMS COMBINED HEATING AND REFRIGERATION SYSTEMS COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT PUMP SYSTEMS HEATING ICE-BOXES LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING REFRIGERATORS SEMICONDUCTOR DEVICES WEAPONS |
| title | Wafer cooling device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T04%3A04%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHI%20ZHIHE&rft.date=2023-04-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN218939608UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |