Wafer cooling device

The utility model provides a device for wafer cooling, and relates to the technical field of cooling devices, the device comprises an upper cooling disc and a semiconductor chilling plate control system, the bottom end of the upper cooling disc is provided with a lower cooling disc, the top end of the lower cooling disc is provided with a U-shaped clamping groove, a semiconductor chilling plate A is installed in the U-shaped clamping groove, and the semiconductor chilling plate A is connected with the semiconductor chilling plate control system. A water pipe pressing plate is fixedly installed at the bottom end of the lower cooling disc, a device supporting column is arranged at the bottom end of the water pipe pressing plate, a cooling water pipe is fixedly installed on the side face of the lower cooling disc, a temperature control switch is installed at the bottom end of the lower cooling disc, and a PT temperature measuring probe is installed at the bottom end of the lower cooling disc. According to the wa