High-precision laser cutting machining device

The utility model discloses a high-precision laser cutting machining device which comprises a machining table, a laser cutter is arranged on the machining table, and a clamping adjusting mechanism is arranged on the machining table. The clamping adjusting mechanism comprises walking wheels, a lower...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: REN DONGDONG, WANG WENSHUAI, WEN MINGJUN, WANG XIANGGANG, REN DECAI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The utility model discloses a high-precision laser cutting machining device which comprises a machining table, a laser cutter is arranged on the machining table, and a clamping adjusting mechanism is arranged on the machining table. The clamping adjusting mechanism comprises walking wheels, a lower pressing plate, a driving part, a gradienter, a lower pressing wheel and a moving part. The walking wheel is arranged on the machining table, the lower pressing plate is arranged on the driving part, the driving part is arranged on the machining table, the gradienter is arranged on the lower pressing plate, the lower pressing wheel is arranged on the lower end face of the lower pressing plate, and the moving part is arranged on the laser cutter. The plate cutting device can be correspondingly adjusted according to different thicknesses of plates to be cut, so that the moving stability of the plates to be cut is higher. 本实用新型公开了一种高精度激光切割加工装置,包括加工台,所述加工台上设置有激光切割器,所述加工台上设置有夹紧调整机构;所述夹紧调整机构包括:行走轮、下压板、驱动部、水平仪、下压轮以及移动部;所述