Packaging structure of ceramic tube shell
The utility model relates to the technical field of packaging, and discloses a packaging structure of a ceramic tube shell, which comprises a ceramic bottom shell, a first mounting groove is arranged on the upper surface of the ceramic bottom shell, and a second mounting groove is arranged on the lo...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of packaging, and discloses a packaging structure of a ceramic tube shell, which comprises a ceramic bottom shell, a first mounting groove is arranged on the upper surface of the ceramic bottom shell, and a second mounting groove is arranged on the lower surface of the ceramic bottom shell. The other side of the interior of the second mounting groove is communicated with the other side of the interior of the first mounting groove through a bonding channel, a conductive metal layer is arranged on the upper side of the interior of the ceramic bottom shell, a metal heat dissipation layer is arranged in the middle of the interior of the ceramic bottom shell, and an insulating ceramic substrate is arranged on the lower side of the interior of the ceramic bottom shell. According to the utility model, a double-sided packaging structure is adopted, a plurality of chips can be packaged in one tube shell at the same time, modularized integrated packaging of the detector |
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