Testing device for monitoring shrinkage stress of photocuring material

The utility model discloses a testing device for monitoring the shrinkage stress of a photocuring material, which is characterized in that an infrared spectrometer emits infrared light to the lower part of a rheometer platform, a plane mirror is adopted as an attenuated total reflection medium, and the infrared light is projected to the surface of a photocuring material sample with a low refractive index from the plane mirror with a high refractive index; when the incident angle is greater than the critical angle, total infrared reflection occurs at the interface of the rheometer platform, and the sample selectively absorbs infrared light, so that the intensity of reflected light is weakened; the infrared signal receiver analyzes the attenuated infrared light signal so as to obtain chemical structure information of the surface layer of the material; ultraviolet light emitted by the ultraviolet laser is radiated to the upper part of the sample; the mechanical sensor is used for monitoring shrinkage stress of t