Guide wheel of silicon wafer polishing machine

The utility model relates to a guide wheel of a silicon wafer polishing machine, and belongs to the technical field of monocrystalline silicon polished wafer production. The annular groove is formed in the non-working area, the upper edge of the annular groove makes contact with the first working area, the lower edge of the annular groove makes contact with the second working area, the first working area is extruded along with abrasion of the pressing head, the second working area is extruded along with abrasion of the carrier plate, and therefore an annular protrusion is formed between the first working area and the second working area. Due to the existence of the annular groove, annular protrusions can be prevented from being formed on the guide wheel, and then the pressing head or the carrier plate is prevented from impacting the protrusions to generate vibration, so that the pressing head stably acts on the carrier plate. The technical problems that in the using process of an existing guide wheel, as a co