High-density multilayer circuit board

The utility model discloses a high-density multilayer circuit board, and relates to the technical field of circuit boards. The high-density multilayer circuit board comprises a weighing plate, a heat dissipation mechanism and a fixing mechanism, two groups of side plates are arranged on the weighing plate, the two groups of side plates are hinged to the outer walls of the two sides of the weighing plate respectively, mounting grooves are formed in the two groups of side plates, and unit circuit boards are arranged in the mounting grooves. According to the high-density multi-layer circuit board, heat dissipation processing can be conveniently carried out on the unit circuit boards, the design that the heat dissipation air openings are formed between the two unit circuit boards is adopted, generated heat can be better blown out, the heat dissipation effect is better, meanwhile, the single unit circuit board can be conveniently mounted and dismounted, the mounting mode is simple, and the cost is low. According t