LED packaging shell capable of improving structural stability

The utility model discloses an LED packaging shell capable of improving structural stability, relates to the technical field of road construction, and aims to solve the problems that in the background technology, the heat dissipation effect is limited, packaging glue is easy to soften, a wafer is easy to be subjected to a desoldering phenomenon, the practicability is low, the wafer is easy to fall off when pseudo soldering or desoldering occurs, and the stability is poor. According to the scheme, the LED lamp comprises a shell, a lens and a wafer, two supporting bases of arc structures are arranged at the bottom of the shell, a heat dissipation mechanism is arranged in the shell, the heat dissipation mechanism comprises a mounting plate, a supporting pipe, a plurality of heat dissipation fins, a fixing plate and four fixing blocks, fixing mechanisms are arranged on the two sides of the wafer, and each fixing mechanism comprises a lead and a pin. According to the utility model, the heat dissipation effect of t