Semiconductor packaging structure

According to the semiconductor packaging structure provided by the invention, the dummy pattern is arranged in the blank area (the non-active area) between the edge/corner of the substrate (a position with a relatively large electric field) and the active area (the deposition area of the circuit pat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WU BOYIN, GUO MINGCANG, JIANG YUANFENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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