Device for manufacturing heat flow probe
A device for manufacturing a heat flow probe is overall a cube, copper core installation areas are located at the front edge and the rear edge of the top face of the device, and a plurality of copper core installation holes (1) with different diameters and depths are formed in the front edge and the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A device for manufacturing a heat flow probe is overall a cube, copper core installation areas are located at the front edge and the rear edge of the top face of the device, and a plurality of copper core installation holes (1) with different diameters and depths are formed in the front edge and the rear edge respectively. The probe core mounting areas are located at the left and right edge positions of the top surface of the device, and a plurality of probe core mounting holes (2) with different diameters and depths and open slots are formed in the left and right edge positions; the probe plate mounting frames (3) are two square step grooves positioned in the center of the top surface of the device; a through hole is formed in the center of the square step groove in the bottom of the probe plate installation frame (3), and piezometer tube leading-out grooves communicated with the through hole are formed in the lower positions of the four side faces of the device. According to the device, potential safety haz |
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