High-heat-dissipation protective film

The utility model provides a high-heat-dissipation protective film which comprises a base material layer, the bottom surface of the base material layer is connected with a first heat-conducting glue layer, the upper surface of the base material layer is connected with a second heat-conducting glue l...

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Bibliographische Detailangaben
1. Verfasser:	LI HENGYING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The utility model provides a high-heat-dissipation protective film which comprises a base material layer, the bottom surface of the base material layer is connected with a first heat-conducting glue layer, the upper surface of the base material layer is connected with a second heat-conducting glue layer, the upper surface of the second heat-conducting glue layer is connected with a heat-conducting graphite layer, and the upper surface of the heat-conducting graphite layer is provided with a copper wire gauze layer. The outer protection layer is arranged on the upper side of the copper wire mesh layer, the heat-conducting pressure-sensitive adhesive layer is arranged between the outer protection layer and the copper wire mesh layer, the heat-conducting pressure-sensitive adhesive layer penetrates through holes in the copper wire mesh layer and is connected with the upper surface of the heat-conducting graphite layer, a single heat-conducting copper wire is fixedly embedded in the upper side face of the base ma