Packaging structure of MEMS flow sensor chip

The utility model relates to the field of packaging structures, in particular to a packaging structure of an MEMS flow sensor chip, which adopts the technical scheme that the packaging structure comprises a sealing cover and is characterized in that an air opening is formed in one side of the top of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TANG HUAYAN, TANG LINGLING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MEASURING MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL METERING BY VOLUME MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS TESTING TRANSPORTING
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