Packaging structure of MEMS flow sensor chip

The utility model relates to the field of packaging structures, in particular to a packaging structure of an MEMS flow sensor chip, which adopts the technical scheme that the packaging structure comprises a sealing cover and is characterized in that an air opening is formed in one side of the top of the sealing cover, a fan is clamped on the inner wall of the air opening, a clamping piece is fixedly connected to the top of the sealing cover, and a filter plate is clamped on the inner wall of the clamping piece; a first filter screen is embedded in the inner wall of the filter plate, a first partition plate is fixedly connected to one side of the inner wall of the sealing cover, a second partition plate is fixedly connected to the other side of the inner wall of the sealing cover, and a second filter screen is embedded in one side of the second partition plate. And most of the gas can be exhausted to the outside through the exhaust port, and a small part of the gas can penetrate through the second filter scree