Chip glue uniformizing back protection structure

The utility model discloses a chip glue uniformizing back protection structure, which relates to the technical field of protection and comprises a chip, a buckle type protection assembly is arranged behind the chip, and the back of a first connecting plate and the back of a second connecting plate a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WANG DAYONG, CHEN NIANJUN, CHEN JUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator WANG DAYONG
CHEN NIANJUN
CHEN JUN
description The utility model discloses a chip glue uniformizing back protection structure, which relates to the technical field of protection and comprises a chip, a buckle type protection assembly is arranged behind the chip, and the back of a first connecting plate and the back of a second connecting plate are composed of a first clamping block, an upper clamping cone, a second clamping block and a lower clamping cone. The mounting frame plate is connected with a clamping groove in the middle of the interior of the connecting rubber disc in a buckled mode through an upper clamping cone and a lower clamping cone, reinforcing plates are fixedly installed at the upper end and the lower end of the rear face of the connecting rubber disc correspondingly, and buckle assemblies are arranged on the left side and the right side of the two reinforcing plates. The buckle assembly is composed of a fixing block, a movable clamping plate, a clamping buckle, a positioning vertical rod, a connecting spring rod and a fixing round slee
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218692405UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218692405UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218692405UU3</originalsourceid><addsrcrecordid>eNrjZDBwzsgsUEjPKU1VKM3LTMsvys2sysxLV0hKTM5WKCjKL0lNLsnMz1MoLikqTS4pLUrlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GhhZmlkYmBqahocZEKQIA8aUssA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chip glue uniformizing back protection structure</title><source>esp@cenet</source><creator>WANG DAYONG ; CHEN NIANJUN ; CHEN JUN</creator><creatorcontrib>WANG DAYONG ; CHEN NIANJUN ; CHEN JUN</creatorcontrib><description>The utility model discloses a chip glue uniformizing back protection structure, which relates to the technical field of protection and comprises a chip, a buckle type protection assembly is arranged behind the chip, and the back of a first connecting plate and the back of a second connecting plate are composed of a first clamping block, an upper clamping cone, a second clamping block and a lower clamping cone. The mounting frame plate is connected with a clamping groove in the middle of the interior of the connecting rubber disc in a buckled mode through an upper clamping cone and a lower clamping cone, reinforcing plates are fixedly installed at the upper end and the lower end of the rear face of the connecting rubber disc correspondingly, and buckle assemblies are arranged on the left side and the right side of the two reinforcing plates. The buckle assembly is composed of a fixing block, a movable clamping plate, a clamping buckle, a positioning vertical rod, a connecting spring rod and a fixing round slee</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230324&amp;DB=EPODOC&amp;CC=CN&amp;NR=218692405U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230324&amp;DB=EPODOC&amp;CC=CN&amp;NR=218692405U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG DAYONG</creatorcontrib><creatorcontrib>CHEN NIANJUN</creatorcontrib><creatorcontrib>CHEN JUN</creatorcontrib><title>Chip glue uniformizing back protection structure</title><description>The utility model discloses a chip glue uniformizing back protection structure, which relates to the technical field of protection and comprises a chip, a buckle type protection assembly is arranged behind the chip, and the back of a first connecting plate and the back of a second connecting plate are composed of a first clamping block, an upper clamping cone, a second clamping block and a lower clamping cone. The mounting frame plate is connected with a clamping groove in the middle of the interior of the connecting rubber disc in a buckled mode through an upper clamping cone and a lower clamping cone, reinforcing plates are fixedly installed at the upper end and the lower end of the rear face of the connecting rubber disc correspondingly, and buckle assemblies are arranged on the left side and the right side of the two reinforcing plates. The buckle assembly is composed of a fixing block, a movable clamping plate, a clamping buckle, a positioning vertical rod, a connecting spring rod and a fixing round slee</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBwzsgsUEjPKU1VKM3LTMsvys2sysxLV0hKTM5WKCjKL0lNLsnMz1MoLikqTS4pLUrlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GhhZmlkYmBqahocZEKQIA8aUssA</recordid><startdate>20230324</startdate><enddate>20230324</enddate><creator>WANG DAYONG</creator><creator>CHEN NIANJUN</creator><creator>CHEN JUN</creator><scope>EVB</scope></search><sort><creationdate>20230324</creationdate><title>Chip glue uniformizing back protection structure</title><author>WANG DAYONG ; CHEN NIANJUN ; CHEN JUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218692405UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG DAYONG</creatorcontrib><creatorcontrib>CHEN NIANJUN</creatorcontrib><creatorcontrib>CHEN JUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG DAYONG</au><au>CHEN NIANJUN</au><au>CHEN JUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip glue uniformizing back protection structure</title><date>2023-03-24</date><risdate>2023</risdate><abstract>The utility model discloses a chip glue uniformizing back protection structure, which relates to the technical field of protection and comprises a chip, a buckle type protection assembly is arranged behind the chip, and the back of a first connecting plate and the back of a second connecting plate are composed of a first clamping block, an upper clamping cone, a second clamping block and a lower clamping cone. The mounting frame plate is connected with a clamping groove in the middle of the interior of the connecting rubber disc in a buckled mode through an upper clamping cone and a lower clamping cone, reinforcing plates are fixedly installed at the upper end and the lower end of the rear face of the connecting rubber disc correspondingly, and buckle assemblies are arranged on the left side and the right side of the two reinforcing plates. The buckle assembly is composed of a fixing block, a movable clamping plate, a clamping buckle, a positioning vertical rod, a connecting spring rod and a fixing round slee</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN218692405UU
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
title Chip glue uniformizing back protection structure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T21%3A54%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WANG%20DAYONG&rft.date=2023-03-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN218692405UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true