Chip glue uniformizing back protection structure
The utility model discloses a chip glue uniformizing back protection structure, which relates to the technical field of protection and comprises a chip, a buckle type protection assembly is arranged behind the chip, and the back of a first connecting plate and the back of a second connecting plate a...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model discloses a chip glue uniformizing back protection structure, which relates to the technical field of protection and comprises a chip, a buckle type protection assembly is arranged behind the chip, and the back of a first connecting plate and the back of a second connecting plate are composed of a first clamping block, an upper clamping cone, a second clamping block and a lower clamping cone. The mounting frame plate is connected with a clamping groove in the middle of the interior of the connecting rubber disc in a buckled mode through an upper clamping cone and a lower clamping cone, reinforcing plates are fixedly installed at the upper end and the lower end of the rear face of the connecting rubber disc correspondingly, and buckle assemblies are arranged on the left side and the right side of the two reinforcing plates. The buckle assembly is composed of a fixing block, a movable clamping plate, a clamping buckle, a positioning vertical rod, a connecting spring rod and a fixing round slee |
---|