Chip integrated circuit material electroplating unit capable of improving protection performance

The utility model relates to the technical field of integrated circuits, in particular to a chip integrated circuit material electroplating unit capable of improving protection performance, which comprises an electroplating tank, an electroplating mechanism is arranged at the top of the electroplating tank, a binding post is fixedly connected to the left side of the electroplating tank, and a control panel is fixedly connected to the right side of the electroplating tank. A liquid inlet pipe is fixedly connected to the left side of the electroplating tank and above the binding post; and the electroplating mechanism comprises a fixed seat fixedly connected to the top of the electroplating pool, the top of the fixed seat is fixedly connected with a winding motor, and the outer wall of an output shaft of the winding motor is fixedly connected with a winding drum. The electroplating unit in the device is used for electroplating a chip integrated circuit material, and the problems that after electroplating treatme