Potting mold of MOV chip

The utility model relates to the technical field of MOV chip insulation packaging, and provides a MOV chip filling and sealing mold, which comprises a bearing base and a plurality of product placing cavities uniformly distributed on the top surface of the bearing base, the product placement cavity c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN ZETONG, FAN ZHENLI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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