Potting mold of MOV chip

The utility model relates to the technical field of MOV chip insulation packaging, and provides a MOV chip filling and sealing mold, which comprises a bearing base and a plurality of product placing cavities uniformly distributed on the top surface of the bearing base, the product placement cavity comprises a placement groove which is sunken downwards, a first installation position arranged in the middle of the placement groove, and a second installation position arranged on the side wall of one side of the placement groove; according to the utility model, the encapsulation mold comprising the bearing base and the plurality of product placement cavities uniformly distributed on the top surface of the bearing base is arranged, glue injection and encapsulation are carried out on the MOV chips, a plurality of MOV chips can be synchronously or continuously encapsulated at one time, the operation is simple, and the encapsulation efficiency of the MOV chips is greatly improved. 本实用新型涉及MOV芯片绝缘封装技术领域，提供一种MOV芯片的灌封模具，包