Controller heat dissipation structure
The utility model discloses a controller heat radiation structure, comprising an upper cover which covers a lower cover, the upper cover and the lower cover jointly form an accommodating space, the accommodating space is used for fixing a PCB assembly, and the top of the accommodating space is provi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a controller heat radiation structure, comprising an upper cover which covers a lower cover, the upper cover and the lower cover jointly form an accommodating space, the accommodating space is used for fixing a PCB assembly, and the top of the accommodating space is provided with a plurality of heat radiation air channels which are high in two ends and low in the middle; the upper cover is covered with the fan cover, at least one heat dissipation hole is formed in the top of the fan cover, and a plurality of air inlet windows are formed in the two ends of the fan cover in the direction of the heat dissipation air channel; and the fan is correspondingly fixed on the heat dissipation holes and is used for extracting hot air in the heat dissipation air duct. According to the utility model, the fan is matched with the air channel (the middle is low and the two ends are high) and the air inlet window to realize active and rapid heat dissipation, heat accumulation caused by a high-power |
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