Welding structure of circuit board
The utility model discloses a welding structure of a circuit board, which comprises a first circuit board and a second circuit board which are connected with each other, the surface of the first circuit board is provided with a first covering film, a first through hole is arranged in the first cover...
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| Hauptverfasser: | , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model discloses a welding structure of a circuit board, which comprises a first circuit board and a second circuit board which are connected with each other, the surface of the first circuit board is provided with a first covering film, a first through hole is arranged in the first covering film, a first bonding pad is formed on the surface of the first circuit board, and a second bonding pad is formed on the surface of the second circuit board. A second covering film is arranged on the surface of the second circuit board, a second through hole is formed in the second covering film, a second bonding pad is formed on the surface of the second circuit board, and the first bonding pad is welded to the second bonding pad through a filling piece. According to the utility model, the structure is simple, direct welding of the first circuit board and the second circuit board is avoided through the filling sheet arranged between the first bonding pad and the second bonding pad, the gap between the first bo |
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