Device for taking chip from wafer
The utility model provides a device for taking a chip from a wafer, which comprises a sorting platform, and a chip ejection mechanism, a wafer storage mechanism, a chip grabbing mechanism and a chip stabilizing mechanism are arranged on the sorting platform. The chip ejection mechanism is arranged o...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model provides a device for taking a chip from a wafer, which comprises a sorting platform, and a chip ejection mechanism, a wafer storage mechanism, a chip grabbing mechanism and a chip stabilizing mechanism are arranged on the sorting platform. The chip ejection mechanism is arranged on one side of the sorting platform, and the chip stabilizing mechanism is arranged on the other side of the sorting platform; a chip ejection mechanism is arranged on the sorting platform, a chip stabilizing mechanism is arranged on the sorting platform, a wafer storage mechanism is arranged on the sorting platform between the chip ejection mechanism and the chip stabilizing mechanism, a chip grabbing mechanism is arranged on the wafer storage mechanism, one end of the chip grabbing mechanism corresponds to the chip ejection mechanism, and the other end of the chip grabbing mechanism corresponds to the chip stabilizing mechanism; according to the utility model, chips with different light-emitting colors on a wafer |
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