DC module heat dissipation structure

The utility model discloses a DC module heat radiation structure, which comprises a heat radiator, IGBT modules, a busbar layer, an insulating layer and a support, and is characterized in that the plurality of IGBT modules are fixedly arranged on the heat radiator; the bracket is fixedly arranged at...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LI YINGCHUN, HE HONGLI, SHAO LI, PU ANHUI, SI LONGBIN, ZOU QINGYANG, LI YI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a DC module heat radiation structure, which comprises a heat radiator, IGBT modules, a busbar layer, an insulating layer and a support, and is characterized in that the plurality of IGBT modules are fixedly arranged on the heat radiator; the bracket is fixedly arranged at one end of the radiator, and a plurality of connecting terminals are arranged on the bracket; the plurality of busbar layers and the plurality of insulating layers are arranged in a staggered manner and are stacked up and down; one end of the busbar layer is connected with the IGBT module, and the other end of the busbar layer is connected with the connecting terminal. According to the DC module heat dissipation structure, the plurality of busbar layers are stacked and installed, the installation space requirement of circuit design is reduced while the large current requirement is met, the assembly space miniaturization of the plurality of busbar layers is achieved, the plurality of stacked busbar layers are benef