Inner-layer interconnected high-density multilayer circuit board

The utility model discloses an inner-layer interconnected high-density multilayer circuit board, which belongs to the technical field of circuit boards, and comprises a first substrate, a second substrate is fixedly arranged at the bottom end of the first substrate, a cavity is arranged between the first substrate and the second substrate, two ventilation square pipes and a heat dissipation plate are arranged in the cavity, and the heat dissipation plate is arranged in the cavity. The heat dissipation plate is located between the two ventilation square pipes, dustproof nets are installed in the two ventilation square pipes, heat dissipated by components on the first substrate and the second substrate is adsorbed into the cavity through the heat dissipation plate, external air enters the cavity, the heat can be taken away, air circulation in the cavity is increased, and the heat dissipation effect is improved. And the dustproof net can prevent dust from entering the cavity, so that the heat dissipation efficie