Inverted packaging structure of light emitting diode

The flip packaging structure comprises a substrate and a flip chip, the outer wall of the bottom of the substrate is provided with through holes which are equidistantly distributed in a matrix structure, the inner side wall of each through hole is sequentially provided with a wedging groove, a limiting groove and an annular groove from top to bottom, the top of the flip chip is provided with a light emitting diode body in a tin soldering mode, and the LED body is provided with an LED chip. The flip chip is arranged in the limiting groove in a matched mode, the light-emitting diode body is arranged in the matched groove in a matched mode, and a heat conduction sleeve connected to the outer portion of the flip chip in a sleeved mode is arranged in the annular groove in a matched mode. The flip chip is wedged in the limiting groove, the light emitting diode body is wedged in the wedging groove, the heat conduction sleeve is sleeved outside the flip chip and wedged in the annular groove, at the moment, the heat c