Packaging body

The utility model discloses a packaging body, and the packaging body comprises an insulating substrate, and two side surfaces of the insulating substrate are respectively provided with a first copper layer and a second copper layer; the first blind hole penetrates through the first copper layer and the insulating substrate, and the hole bottom of the first blind hole is the surface of the side, close to the insulating substrate, of the second copper layer; and the chip is attached to the hole bottom of the first blind hole. The first blind hole is formed in the insulating substrate, and the chip is embedded in the first blind hole, so that the chip can be partially or completely embedded in the insulating substrate, and the thickness of the packaging body is effectively reduced. 本申请公开了一种封装体，包括：绝缘基板，绝缘基板的两侧表面分别设置有第一铜层与第二铜层；至少一个第一盲孔，第一盲孔贯穿第一铜层与绝缘基板，第一盲孔的孔底为第二铜层靠近绝缘基板的一侧表面；至少一个芯片，芯片贴装于第一盲孔的孔底。本申请通过在绝缘基板上形成第一盲孔，并在第一盲孔中嵌入芯片，能够使芯片部分或全部嵌入在绝缘基板中，从而有效降低封装体的厚度。