Wafer alignment device

The utility model provides a wafer alignment device. The wafer alignment device at least comprises a base assembly, a first movement system, a second movement system, an alignment detection system and an in-place detection system. According to the utility model, the alignment state is fed back in re...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: XIE YIREN, YU HONGLIANG, WU HUOLIANG, CHEN CHUNYUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator XIE YIREN
YU HONGLIANG
WU HUOLIANG
CHEN CHUNYUAN
description The utility model provides a wafer alignment device. The wafer alignment device at least comprises a base assembly, a first movement system, a second movement system, an alignment detection system and an in-place detection system. According to the utility model, the alignment state is fed back in real time by combining the adjustment precision grading of the motion platform and the cooperative application of the optical lens of the detection system, so that the alignment precision between wafers and the in-place precision of the motion platform are improved; meanwhile, the driving systems of different dimensions of the detection system are tiled and separated, so that the mutual influence during adjustment of the driving systems of different dimensions is reduced, the adjustment precision is improved, and the height in the third direction is reduced; in addition, by means of the air flotation guide connection design, center rotation motion in a two-dimensional plane is achieved, alignment precision can be imp
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218548395UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218548395UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218548395UU3</originalsourceid><addsrcrecordid>eNrjZBALT0xLLVJIzMlMz8tNzStRSEkty0xO5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RoYWpiYWxpamoaHGRCkCAN61Ik8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer alignment device</title><source>esp@cenet</source><creator>XIE YIREN ; YU HONGLIANG ; WU HUOLIANG ; CHEN CHUNYUAN</creator><creatorcontrib>XIE YIREN ; YU HONGLIANG ; WU HUOLIANG ; CHEN CHUNYUAN</creatorcontrib><description>The utility model provides a wafer alignment device. The wafer alignment device at least comprises a base assembly, a first movement system, a second movement system, an alignment detection system and an in-place detection system. According to the utility model, the alignment state is fed back in real time by combining the adjustment precision grading of the motion platform and the cooperative application of the optical lens of the detection system, so that the alignment precision between wafers and the in-place precision of the motion platform are improved; meanwhile, the driving systems of different dimensions of the detection system are tiled and separated, so that the mutual influence during adjustment of the driving systems of different dimensions is reduced, the adjustment precision is improved, and the height in the third direction is reduced; in addition, by means of the air flotation guide connection design, center rotation motion in a two-dimensional plane is achieved, alignment precision can be imp</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230228&amp;DB=EPODOC&amp;CC=CN&amp;NR=218548395U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230228&amp;DB=EPODOC&amp;CC=CN&amp;NR=218548395U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XIE YIREN</creatorcontrib><creatorcontrib>YU HONGLIANG</creatorcontrib><creatorcontrib>WU HUOLIANG</creatorcontrib><creatorcontrib>CHEN CHUNYUAN</creatorcontrib><title>Wafer alignment device</title><description>The utility model provides a wafer alignment device. The wafer alignment device at least comprises a base assembly, a first movement system, a second movement system, an alignment detection system and an in-place detection system. According to the utility model, the alignment state is fed back in real time by combining the adjustment precision grading of the motion platform and the cooperative application of the optical lens of the detection system, so that the alignment precision between wafers and the in-place precision of the motion platform are improved; meanwhile, the driving systems of different dimensions of the detection system are tiled and separated, so that the mutual influence during adjustment of the driving systems of different dimensions is reduced, the adjustment precision is improved, and the height in the third direction is reduced; in addition, by means of the air flotation guide connection design, center rotation motion in a two-dimensional plane is achieved, alignment precision can be imp</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBALT0xLLVJIzMlMz8tNzStRSEkty0xO5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RoYWpiYWxpamoaHGRCkCAN61Ik8</recordid><startdate>20230228</startdate><enddate>20230228</enddate><creator>XIE YIREN</creator><creator>YU HONGLIANG</creator><creator>WU HUOLIANG</creator><creator>CHEN CHUNYUAN</creator><scope>EVB</scope></search><sort><creationdate>20230228</creationdate><title>Wafer alignment device</title><author>XIE YIREN ; YU HONGLIANG ; WU HUOLIANG ; CHEN CHUNYUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218548395UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>XIE YIREN</creatorcontrib><creatorcontrib>YU HONGLIANG</creatorcontrib><creatorcontrib>WU HUOLIANG</creatorcontrib><creatorcontrib>CHEN CHUNYUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XIE YIREN</au><au>YU HONGLIANG</au><au>WU HUOLIANG</au><au>CHEN CHUNYUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer alignment device</title><date>2023-02-28</date><risdate>2023</risdate><abstract>The utility model provides a wafer alignment device. The wafer alignment device at least comprises a base assembly, a first movement system, a second movement system, an alignment detection system and an in-place detection system. According to the utility model, the alignment state is fed back in real time by combining the adjustment precision grading of the motion platform and the cooperative application of the optical lens of the detection system, so that the alignment precision between wafers and the in-place precision of the motion platform are improved; meanwhile, the driving systems of different dimensions of the detection system are tiled and separated, so that the mutual influence during adjustment of the driving systems of different dimensions is reduced, the adjustment precision is improved, and the height in the third direction is reduced; in addition, by means of the air flotation guide connection design, center rotation motion in a two-dimensional plane is achieved, alignment precision can be imp</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN218548395UU
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Wafer alignment device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T23%3A38%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=XIE%20YIREN&rft.date=2023-02-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN218548395UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true