Plate exchange type energy-saving semiconductor heating body
The utility model relates to a plate exchange type energy-saving semiconductor heating body, which comprises a mounting frame and a semiconductor heating body, a limiting sleeve shell is fixedly connected inside the mounting frame, a limiting spring is fixedly connected inside the limiting sleeve sh...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to a plate exchange type energy-saving semiconductor heating body, which comprises a mounting frame and a semiconductor heating body, a limiting sleeve shell is fixedly connected inside the mounting frame, a limiting spring is fixedly connected inside the limiting sleeve shell, one end of the limiting spring far away from the limiting sleeve shell is fixedly connected with a limiting block, and the limiting block is fixedly connected with the limiting sleeve shell. A heat conduction block is fixedly connected to the exterior of the mounting frame, a fixing cover is inserted into the heat conduction block, a fixing sleeve shell is fixedly connected to the side wall of the heat conduction block, and a fixing rod is inserted into the fixing sleeve shell. According to the plate replacement type energy-saving semiconductor heating body, the semiconductor heating body is pulled to be taken out for maintenance, the limiting state of the limiting hole is canceled by pulling the fixing rod, t |
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