Package

The utility model provides a packaging part. The packaging part comprises an electronic component; the packaging layer surrounds the electronic component, and the top surface of the packaging layer and the top surface of the electronic component are coplanar; the heat conduction pattern layer is located on the packaging layer, and the heat conduction pattern layer comprises a connecting part and a fixing part which protrudes out of the connecting part and is distributed on at least one side of the connecting part. 本申请提供了一种封装件，包括：电子元件；封装层，围绕所述电子元件，并且所述封装层的顶面与所述电子元件的顶面共面；以及导热图案层，位于所述封装层上，其中，所述导热图案层包括连接部，以及突出于所述连接部并且分布在所述连接部的至少一侧处的固定部。