Internal heat dissipation diaphragm of electronic equipment
The utility model relates to the technical field of heat dissipation materials of electronic and electrical appliances, and discloses an internal heat dissipation membrane of electronic equipment, which comprises a base membrane, a conductive copper foil is adhered to the top of the base membrane th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of heat dissipation materials of electronic and electrical appliances, and discloses an internal heat dissipation membrane of electronic equipment, which comprises a base membrane, a conductive copper foil is adhered to the top of the base membrane through heat-conducting glue, an adhesive layer is coated on the top of the conductive copper foil, heat-conducting fins are adhered to the bottom of the base membrane through heat-conducting glue, and the heat-conducting fins are coated on the adhesive layer. The bottom of the base layer membrane is bonded with a soft recovery layer through fixing glue, the interior of the soft recovery layer is hollow, a through hole is formed in the front face of the soft recovery layer, the bottom of the soft recovery layer is bonded with a tensile woven layer through fixing glue, and the bottom of the tensile woven layer is bonded with a wear-resistant layer through fixing glue; according to the electronic equipment, a good heat |
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