Integrated circuit chip

The embodiment of the utility model relates to an integrated circuit chip. An integrated circuit chip includes: a front-end-of-line (FEOL) structure; a back end of line (BEOL) structure on the FEOL structure; wherein the BEOL structure includes: a last metal structure providing a bond pad; a passivation structure covering a peripheral region of the last metal structure and including a first opening extending through the passivation structure and exposing an upper surface of the last metal structure; a conformal nitride layer extending over the passivation structure and in contact with an upper surface of the last metal structure; and an insulating material layer covering the conformal nitride layer and including a second opening extending through the insulating material layer and the conformal nitride layer, where a bottom of the conformal nitride layer on the upper surface of the last metal structure is self-aligned with the second opening. Embodiments of the present disclosure advantageously support the for