Installation damping structure of high-performance chip

The utility model relates to the technical field of chips, and discloses a mounting damping structure of a high-performance chip, which comprises a protective shell, a cover plate and a high-performance chip body, and is characterized in that two groups of buffer mechanisms are arranged in the prote...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TANG HUAYAN, TANG LINGLING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MEANS FOR DAMPING VIBRATION MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES SHOCK-ABSORBERS SPRINGS THERMAL INSULATION IN GENERAL WEAPONS
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