Installation damping structure of high-performance chip

The utility model relates to the technical field of chips, and discloses a mounting damping structure of a high-performance chip, which comprises a protective shell, a cover plate and a high-performance chip body, and is characterized in that two groups of buffer mechanisms are arranged in the prote...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TANG HUAYAN, TANG LINGLING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model relates to the technical field of chips, and discloses a mounting damping structure of a high-performance chip, which comprises a protective shell, a cover plate and a high-performance chip body, and is characterized in that two groups of buffer mechanisms are arranged in the protective shell and are symmetrically distributed about the axis of the protective shell; the buffering mechanism comprises two sliding rails, the two sliding rails are installed on the inner wall of the protection shell, and sliding blocks are slidably connected into the two sliding rails. According to the installation damping structure of the high-performance chip, when the high-performance chip is arranged in the protective shell, the two sliding blocks move oppositely to drive the push rod to move, the push rod drives the piston to move, and gas in the gas cylinder enters the gas bag through the gas pipe, so that the pressure in the gas bag is increased, and it is guaranteed that the gas bag has sufficient pressure