Heat dissipation type memory chip

The utility model belongs to the technical field of storage chips, and particularly relates to a heat dissipation type storage chip which comprises a heat conduction shell and a storage chip body, a first installation groove is formed in the outer side face of the heat conduction shell, a first heat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AN JUNYING, LIAN GUOWEI, WANG HUAN, CHEN RUILI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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