Heat dissipation type memory chip

The utility model belongs to the technical field of storage chips, and particularly relates to a heat dissipation type storage chip which comprises a heat conduction shell and a storage chip body, a first installation groove is formed in the outer side face of the heat conduction shell, a first heat conduction film is installed in the first installation groove in an attached mode, and heat dissipation blocks are arranged above and below the storage chip body. A plurality of heat dissipation holes are formed in the heat dissipation block at equal intervals, and a second heat conduction plate is attached to the top face of the storage chip body. According to the storage chip, the first heat conduction plate, the second heat conduction plate, the two second heat conduction films, the heat dissipation block and the first heat conduction strip are mutually connected and matched with the external heat conduction shell for use, and finally heat is transferred to the first heat conduction film on the outermost side f