High-efficiency heat dissipation packaging substrate

The utility model relates to the technical field of packaging substrates, and provides an efficient heat dissipation packaging substrate, which comprises a substrate main body and a base, the base is arranged at the bottom end of the substrate main body, a reinforcing structure is arranged in the substrate main body, fixing structures are arranged on two sides in the substrate main body, and heat dissipation structures are arranged on two sides of the substrate main body. The heat dissipation structure comprises heat conduction plates, cooling fins and cooling fins, the heat conduction plates are arranged on the two sides of the substrate body, the cooling fins are arranged on one sides of the heat conduction plates, and the cooling fins are arranged at the top ends of the cooling fins. According to the utility model, through the arrangement of the heat dissipation structure, when the packaging substrate is used for a long time, the conditions that the temperature is too high and heat dissipation is not fast