High-performance mica heating plate for semiconductor material high-temperature constant-temperature baking oven

The utility model discloses a high-performance mica heating plate for a semiconductor material high-temperature constant-temperature baking oven. The high-performance mica heating plate comprises a first mica substrate, a second mica base plate is arranged on one side of the first mica base plate, a connecting mechanism is arranged between the first mica base plate and the second mica base plate, a heat preservation mechanism is arranged on the periphery of the connecting mechanism, the connecting mechanism comprises mounting grooves, electric heating wires, clamping grooves and clamping rods, and the mounting grooves are formed in the inner side of the first mica base plate at equal intervals; according to the utility model, the connecting mechanism is arranged between the first mica substrate and the second mica substrate, and the mounting grooves and the arc grooves are used for replacing adhesive glue, so that formaldehyde is prevented from being generated when the device is heated and used, the use safet