Photoetching machine loading platform for thin wafer

A photoetching machine object carrying platform for a thin wafer comprises a platform body and a plurality of lifting holes formed in the platform body, and further comprises a first supporting boss which is arranged along the edges of the lifting holes and used for supporting the wafer; the middle area frame surrounds the multiple supporting bosses, and a vacuum adsorption cavity is formed between the middle area frame and the supporting bosses; and the second supporting bosses are closely distributed in the vacuum adsorption cavity and are located between the first supporting bosses and the middle area frame. According to the utility model, through the arrangement of the supporting bosses, the contact area with the wafer can be increased, so that the local deformation of the wafer caused by vacuum adsorption can be effectively reduced; the middle area frame is arranged, so that the wafer can be manually taken out when the photoetching machine breaks down, and the damage to the carrying platform is reduced;