Server heat dissipation device
A server heat dissipation device is combined on a main board device, and the main board device comprises a main board. The mainboard is provided with an air inlet area, a first heat dissipation area and a second heat dissipation area. The first heat dissipation area is located between the air inlet...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A server heat dissipation device is combined on a main board device, and the main board device comprises a main board. The mainboard is provided with an air inlet area, a first heat dissipation area and a second heat dissipation area. The first heat dissipation area is located between the air inlet area and the second heat dissipation area. The server heat dissipation device comprises a first heat dissipation module located in the first heat dissipation area and a second heat dissipation module located in the second heat dissipation area. The first heat dissipation module comprises a first side close to the air inlet area, a second side opposite to the first side and close to the second heat dissipation area, a third side connected with the first side and the second side, and a fourth side opposite to the third side and connected with the first side and the second side. By means of the design that the first heat dissipation module inclines in the direction from the third side to the fourth side and the applic |
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