Wire cutting machine

According to the wire cutting machine provided by the embodiment of the invention, the liquid storage tank is internally provided with the cutting fluid with the discharge medium function, the part, making contact with the to-be-cut rod, of the cutting wire in the cutting area is immersed into the cutting fluid, and the to-be-cut rod is cut by soaking the cutting area; the cutting fluid is driven to enter the cutting area through the movement of the cutting line to realize cooling and lubrication in the cutting area; and meanwhile, when the cutting line is used for discharging combined machining, a more sufficient cooling condition can be obtained, thermal damage is improved, the service life of the cutting line is prolonged, the wafer quality of the wafer is improved, and the thermal stress of the wafer is eliminated. The discharge effect of the cutting line can be improved through immersion type cutting, the actual injection amount of the cutting fluid in the line seam is increased, the cutting fluid servin